Compressed Reticle Prices

 

ITEM

PROCESS

GEOMETRY

DIMENSIONS

PRICE

UNIVERSITY

PRICE

COMMERCIAL

PRICE

MIL/HI-REL

 

Masks + 1 wafer

FA/FC

0.5 µm

Max 8.26 x 4.16 mm

$20,000

$25,000

$35,000

 

Additional wafer

FA/FC

0.5 µm

 (34.36 mm2)

$6,000

$8,000

$9,000

 

Masks + 1 wafer

GA/GC

0.25 µm

Max 8.26 x 3.86 mm

$25,000

$30,000

$40,000

 

Additional wafer

GA/GC

0.25 µm

 (31.88 mm2)

$6,500

$8,500

$10,000

 

 

CYCLE TIMES

ACTIVITY

FA PROCESS

FC PROCESS

GA/GC PROCESS

Mask data approval

1 week

1 week

1 week

Mask Tooling

2 weeks

2 weeks

2 weeks

Wafer Fab Cycle

5 weeks

6 weeks

6 weeks

PCM, WLR, Back Grind and shipping

1 week

1 week

1 week

TOTAL

11 weeks

12 weeks

12 weeks

Notes

  1. All prices are in USD
  2. CAD files to be supplied in GDSII format and are subject to approval before processing.
  3. Sapphicon will supply Process Control Monitors (PCMs). These will be incorporated into the die by the customer.
  4. Multiple dice may be incorporated into the field.
  5. Number of complete product fields per wafer: 450 approx.
  6. Standard Back Grind thickness is 8 mil.
  7. Dicing and packaging will be quoted separately because of the number of available package types.
  8. Prices current from February 2010